sponsored by ISHM--the Microelectronics Society, the International Electronics Packaging Society ; in cooperation with IEEE/Components, Hybrids, and Materials Technology Section, IPC--the Institute for Interconnecting and Packaging Electronic Circuits ; endorsed by EIA--Electronic Industrial Association
Julian P. Bristow, Suning Tang, chairs/editors ; sponsored by SPIE--the International Society for Optical Engineering ; cooperating organization, DARPA--Defense Advanced Research Projects Agency
