Advances in electronic packaging, 1995 : proceedings of the International Intersociety Electronic Packaging Conference--INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii
Conferences
International Intersociety Electronic Packaging Conference--INTERpack (1995 : Lahaina, Maui, Hawaii)
sponsored by the Electrical and Electronic Packaging Division, ASME ; the Japan Society of Mechanical Engineers ; edited by Tai Ran Hsu, Avram Bar-Cohen, Wataru Nakayama