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Special issue on simulation, modeling, and electrical design of high-speed and high-density interconnects
- Available as
- Online
Details
- Creator
- guest editor W. W. M. Dai
- Included Titles
-
- IEEE Xplore
- IEEE Xplore journals
- Format
- Books
- Language
- English
- Contributors
- Publication
-
- New York, NY : Institute of Electrical and Electronics Engineers, c1992
- Physical Details
-
- p. 761-851 : ill. ; 28 cm
- Cover title
- Includes bibliographical references.
- Also available in electronic format via the World Wide Web.