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Materials for Electronics Security and Assurance
- Author / Creator
- Available as
- Online
Details
- Creator
- Navid Asadizanjani, Chengjie Xi, and Mark M. Tehranipoor
- Format
- Books
- Language
- English
- Contributors
- Publication
-
- First edition
- Amsterdam, Netherlands : Elsevier, [2024]
- ©2024
- Physical Details
-
- 1 online resource (224 pages)
- ISBNs
- 9780443185434, 0443185433, 9780443185427
- Includes bibliographical references and index.
- Intro -- Title page -- Table of Contents -- Copyright -- About the authors -- Preface -- Acknowledgment -- Chapter 1: Material for heterogeneous integration: Challenges and opportunities -- Abstract -- 1.1. Introduction -- 1.2. Background -- 1.3. Security threats in heterogeneous integration circuits -- 1.4. Post-packaging assurance: Nondestructive physical inspection for HI -- 1.5. Postpackaging assurance: Destructive physical inspection for HI -- 1.6. Prepackaging assurance: MEMS & -- NEMS -- 1.7. Discussion & -- conclusion -- References -- Chapter 2: Packaging encapsulant material for hardware assurance -- Abstract -- 2.1. Introduction -- 2.2. Background of IC encapsulant -- 2.3. Threat models -- 2.4. Encapsulant material characterization for hardware assurance -- 2.5. Summary and discussion -- References -- Chapter 3: Packaging encapsulant material characterization for counterfeit IC detection -- Abstract -- 3.1. Introduction -- 3.2. Background: Material for counterfeit detection -- 3.3. Chemometrics -- 3.4. Experiment material and methods -- 3.5. Conclusion and future work -- References -- Chapter 4: THz for semiconductor assurance -- Abstract -- 4.1. Introduction -- 4.2. THz physical inspection -- 4.3. THz signal and detector hardware -- 4.4. THz applications -- 4.5. THz for material characterization -- 4.6. THz-time domain spectroscopy (TDS) imaging -- 4.7. Conclusion -- References -- Chapter 5: Scanning acoustic microscopy package fingerprint extraction for integrated circuit hardware assurance -- Abstract -- 5.1. Introduction -- 5.2. Fundamental physics -- 5.3. Application to counterfeit detection -- 5.4. Application of failure analysis -- 5.5. Postimaging process -- 5.6. Conclusions -- References -- Chapter 6: Texture analysis of encapsulant packaging materials -- Abstract -- 6.1. Introduction
- 6.2. Package texture analysis for counterfeit defect detection -- 6.3. Imaging modalities for package texture analysis -- 6.4. Image preprocessing for package texture analysis -- 6.5. Challenges -- 6.6. Conclusion -- References -- Chapter 7: MEMS devices in HI packaging -- Abstract -- 7.1. Introduction -- 7.2. Background -- 7.3. Security analysis and vulnerabilities -- 7.4. Existing countermeasures and solutions -- 7.5. Proposed assurance techniques and future directions -- 7.6. Discussion and conclusion -- References -- Chapter 8: Tracking and tracing methods for hardware assurance -- Abstract -- 8.1. Introduction -- 8.2. Hardware security background -- 8.3. Tracking and tracing methods -- 8.4. Vulnerabilities of existing IC T& -- T methods -- 8.5. Natural inherent T& -- T methods -- 8.6. Geomagnetic natural inherent (GNI) T& -- T methods -- 8.7. Terahertz for IC T& -- T -- 8.8. Conclusion -- References -- Chapter 9: Sample preparation for hardware assurance -- Abstract -- 9.1. Introduction -- 9.2. Background -- 9.3. Sample preparation approaches -- 9.4. IC package structure parameters -- 9.5. Extracting structure parameters -- 9.6. Digital twin aided structure analysis -- 9.7. Discussion and conclusion -- References -- Chapter 10: Silicon photonic packaging: Complexity and challenges for assurance -- Abstract -- 10.1. Introduction -- 10.2. Background -- 10.3. Security vulnerability in SiPH devices -- 10.4. Silicon photonics packaging assurance -- 10.5. Discussion & -- conclusion -- References -- Chapter 11: Advanced IC packaging design for material inspection -- Abstract -- 11.1. Introduction -- 11.2. Background and motivation -- 11.3. Nondestructive methods for advanced IC packaging characterization -- 11.4. Exploring factors influencing X-ray compatibility -- 11.5. Metric for X-ray inspection compatibility
- 11.6. Formulation of the design metric -- 11.7. Conclusion -- References -- Chapter 12: Electron beam probing for advanced IC packaging assurance -- Abstract -- 12.1. Introduction -- 12.2. Background and motivation -- 12.3. Principle of e-beam probing (EBP) -- 12.4. Probing technique for hardware security vulnerabilities -- 12.5. Optical probing vs EBP -- 12.6. Process and challenges of performing EBP on advanced packaging devices -- 12.7. Experiment and challenges -- 12.8. Discussion and conclusion -- References -- Index