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Proceedings of the Twenty First InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ITherm 2022 : May 31-June 3, 2022, San Diego, CA, USA
- Author / Creator
- Conferences
- IEEE InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
- Available as
- Online
- Summary
-
The ITherm Conference series is the leading international venue for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic de...
The ITherm Conference series is the leading international venue for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.
Details
- Creator
- IEEE InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
- Format
- Books
- Language
- English
- Publication
-
- Piscataway, NJ : IEEE, 2022
- Physical Details
-
- 1 online resource (1309 pages) : illustrations
- ISBNs
- 9781665485036, 1665485035, 1665485043
- Welcome to ITherm 2022 -- ITherm Committees -- Keynotes -- ITherm Award of Excellence -- Student Heat Sink Challenge -- Technology-Talk Sessions -- ITherm Best Papers from 2021 -- Call for Papers: ITherm 2023 in Las Vegas, NV USA -- TRACK TI: COMPONENT‐LEVEL THERMAL MANAGEMENT -- TRACK TII: SYSTEM‐LEVEL THERMAL MANAGEMENT -- TRACK M: MECHANICS AND RELIABILITY -- TRACK E: EMERGING TECHNOLOGIES AND FUNDAMENTALS