MARC Bibliographic Record

LEADER01776cam-a2200445zu-4500
001 991023187494902122
005 20210807001033.0
008 160829s2003 xx o eng d
035    $a(CKB)3360000000362770
035    $a(SSID)ssj0001233604
035    $a(PQKBManifestationID)12396419
035    $a(PQKBTitleCode)TC0001233604
035    $a(PQKBWorkID)11192582
035    $a(PQKB)10242847
035    $a(EXLCZ)993360000000362770
040    $aPQKB
041    $aeng
050 _0 $aTK7875.R439 2003
082    $a621.381
245 00 $aReliability, testing, and characterization of MEMS/MOEMS II : 27-29 January 2003, San Jose, California, USA
264 31 $a[Place of publication not identified]$bSPIE$c2003
336    $atext$btxt
337    $acomputer$bc
338    $aonline resource$bcr
490 0_ $aSPIE proceedings series Reliability, testing, and characterization of MEMS/MOEMS II
500    $aBibliographic Level Mode of Issuance: Monograph
546    $aEnglish
650 _0 $aMicroelectromechanical systems$xReliability$vCongresses
650 _0 $aMicroelectromechanical systems$xTesting$vCongresses
650 _7 $aElectrical & Computer Engineering$2HILCC
650 _7 $aEngineering & Applied Sciences$2HILCC
650 _7 $aElectrical Engineering$2HILCC
700    $aTanner, Danelle Mary$eContributor
700    $aRamesham, Rajeshuni$eContributor
710    $aSociety of Photo-optical Instrumentation Engineers$eContent Provider
710 2_ $aSandia National Laboratories$eContent Provider
710 2_ $aSociety of Photo Optical Instrumentation Engineers$eContent Provider
710 2_ $aSolid State Technology (Organization)$eContent Provider
710 2_ $aSemiconductor Equipment and Materials International$eContent Provider
776    $z0-8194-4780-3
906    $aBOOK

MMS IDs

Document ID: 9913570673102121
Network Electronic IDs: 9913570673102121
Network Physical IDs:
mms_mad_ids: 991023187494902122
mms_ml_ids: 991013353322502124