ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels : collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems : July 6-9, 2015, San Francisco, California, USA
International Conference on Nanochannels, Microchannels and Minichannels (13th : 2015 : San Francisco, California)
ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2015 : San Francisco, California)
Title from ASME website: ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (ICNMM2015)
Title at top of each PDF article: Proceedings of the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM2015, July 6-9, 2015, San Francisco, California, USA
New York, N.Y. : American Society of Mechanical Engineers, 2015
Physical Details
1 online resource : illustrations
ISBNs
9780791856871
OCLC
ocn932228953
Includes bibliographical references.
Advanced fabrication and manufacturing. Novel fabrication methods for micro- and nano-scale devices -- Emerging technology frontiers. Nanoscale heat transport and characterization methods ; Power electronics and electric machines ; Thermal management: mobile applications -- Energy, health and water-applications of nano-, micro- and mini-scale devices. Biomicrofluidics and lab-on-a-chip ; Fuel cells and other energy devices ; Mixing, mass transfer, and chemical reactions ; Transport in membranes -- Fundamentals of thermal and fluid transport in nano, micro, and mini scales. Continuum/atomistic modeling and simulations ; Electrokinetic flows ; Micro/nano structures in phase change heat transfer ; Pool boiling and condensation ; Single phase flows ; Thin film/surface tension driven flows ; Two phase flows -- MEMS and NEMS. N/MEMS: Emerging technology -- Thermal management. Air cooling: heat sink to system level ; Thermal management: Phase change materials -- Thermal management using micro channels, jets, sprays. Advanced and oscillating heat pipes ; Cold plate integration ; Embedded cooling for 3D ICs ; Flow-boiling experimental investigations ; Liquid and synthetic jets ; Single phase cooling fundamentals ; Two phase boiling computational modeling challenges ; Vapor chambers and condensation