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Photonics packaging and integration V : 27 January, 2005, San Jose, California, USA
- Available as
- Physical
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- Creator
- Randy A. Heyler, Ray T. Chen, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering
- Included Title
-
- Optoelectronic interconnects. Photonics packaging and integration
- Format
- Books
- Language
- English
- Publication
-
- Bellingham, Wash. : SPIE, [2005]
- ©2005
- Physical Details
-
- v, 136 pages : illustrations ; 28 cm
- ISBNs
- 9780819457059, 0819457051
- OCLC
- ocm59759687
- Some earlier conferences were part of a larger conference entitled: Optoelectronic interconnects. Photonics packaging and integration.
- Includes bibliographical references and author index.